MANUFACTURE OF CERAMIC SUBSTRATE PROVIDED WITH CONDUCTOR VIA HOLE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing an extremely thin ceramic substrate whereupon conductor pins with a small pin diameter are accurately arranged and buried at a narrow pitch. SOLUTION: A perhydropolysilazane layer 30 is formed by almost uniformly applying low-temperature baking type perhydropolysilazane on the top plane of a table 10 whereupon conductor pins 20 are stood and arranged and drying the perhydropolysilazane. A plurality of perhydropolysilazane layers 30 are laminated to a level close to the top edge of the conductor pins 20. Then, a plurality of the laminated perhydropolysilazane layers 30 on the top plane of the table 10 are baked at a low-temperature of 250-300 deg.C, and a plurality of the laminated perhydropolysilazane layer 30 are baked to be ceramic integrally under the condition that the conductor pins 20 vertically penetrate the perhydropolysilazane layers 30 and are integrally buried. Then, a plurality of the perhydropolysilazane layers 30 baked integrally to be ceramic are removed from the table 10 with the conductor pins 20.