摘要 |
<p>PROBLEM TO BE SOLVED: To improve the working efficiency and reliability by automating he observation of the sectional structure of a fine electronic device, using a charged particle beam. SOLUTION: This method automatically determines the section processing condition with a charged particle beam on the basis of test results (of electric characteristics, foreign matter size and position thereof) and database (design, processing shape and processing characteristic databases), using a defect analyzing tool 3, processing shape determining means 4, 3dimensional shape CAD 6 and scan condition determining means 9. After processing, for the sectional observation, the charged particle beam is automatically positioned, focused and adjusted for the astigmatic correction, etc., and obtained tomographic data is automatically optimized and displayed on a display means (monitor) for the sectional observation.</p> |