发明名称 |
SHORT OPTICAL SUBASSEMBLY |
摘要 |
PROBLEM TO BE SOLVED: To manufacture a laser package in simple assembly steps and make the package shorter than a package which has a photodiode mounted on a carrier. SOLUTION: This is the optical subassembly 10 which includes a platform 12 having a laser 18 and a photodiode 14 mounted thereupon. The laser 18 has a back surface that only part of light emitted by the laser 18 passes through. The photodiode 14 is mounted on the top surface of the platform so that its light reception surface which receives part of the light emitted from the back surface of the laser is almost perpendicular to the light emission surface of the laser. On the top surface of the platform, a channel 34 can be provided. This channel 34 can be formed while tapered from a narrow end part 36 near the laser 18 to a wide end part 38 near the photodiode 14, and coated with a light reflecting material. |
申请公布号 |
JPH09222540(A) |
申请公布日期 |
1997.08.26 |
申请号 |
JP19960341447 |
申请日期 |
1996.12.20 |
申请人 |
LE-SENTO TECHNOL INC |
发明人 |
FUERITSUKUSU ANIGUBO;MINDOOGASU FUAANNANDO DAATAATASU;UIRIAMU MAIKERU MAKUDONARUDO;EDOWAADO EE PITSUTOMAN;DEIBUITSUDO ANDORIYUU RAMUSEI;DOMINITSUKU POORU RINAADO;IUUFUEN UON |
分类号 |
G01J1/02;G02B6/32;G02B6/42;H01L21/66;H01S5/00;H01S5/02;H01S5/022 |
主分类号 |
G01J1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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