发明名称 Composition of phenolic resin-modified epoxy resin and straight chain polymer
摘要 A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.
申请公布号 US5661223(A) 申请公布日期 1997.08.26
申请号 US19950476578 申请日期 1995.06.07
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 OKA, SEIJI;NONOGAKI, MITSUHIRO;KIKUCHI, TAKUMI;TAKAHAMA, TAKASHI;NAKAJIMA, HIROYUKI;FUTAKUCHI, MICHIO
分类号 C08G59/06;C08G59/30;C08G59/32;C08L63/00;H05K1/03;(IPC1-7):C08L63/02 主分类号 C08G59/06
代理机构 代理人
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