发明名称 |
Composition of phenolic resin-modified epoxy resin and straight chain polymer |
摘要 |
A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.
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申请公布号 |
US5661223(A) |
申请公布日期 |
1997.08.26 |
申请号 |
US19950476578 |
申请日期 |
1995.06.07 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
OKA, SEIJI;NONOGAKI, MITSUHIRO;KIKUCHI, TAKUMI;TAKAHAMA, TAKASHI;NAKAJIMA, HIROYUKI;FUTAKUCHI, MICHIO |
分类号 |
C08G59/06;C08G59/30;C08G59/32;C08L63/00;H05K1/03;(IPC1-7):C08L63/02 |
主分类号 |
C08G59/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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