SEMICONDUCTOR INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To obtain a three-dimensional semiconductor integrated circuit, having high-speed operability and high functionality, by electrically connecting a semiconductor element, integrated on a semiconductor board, and one or more semiconductor elements, placed on an insulating layer, through windows formed in the insulating layer. SOLUTION: Windows are formed in an insulating layer 300, and a lightreceiving element 100A and a plane luminous element 100B are connected with metal traces 200A on an integrated circuit board 200 through the windows using traces 400. At this time, using the insulating layer 300 as an adhesive layer facilitates the threedimensional arrangement of semiconductor elements. Since the adhesive layer is non-conductive, it is possible to easily form traces on the adhesive layer, and thus to provide the elements placed in the integrated circuit with required traces. This obtains an optical array switch with a high extinction ratio and a simple optical system, having high-speed responsivity.