发明名称 |
Method of bonding an aluminum wire to an intergrated circuit bond pad |
摘要 |
A process for manufacturing bonding pad adapted for use with an aluminum wire that resists stresses that would otherwise peel the pad from the substrate. The pad has a polysilicon layer adhered to an insulating layer on a semiconductor substrate, a overlying refractory metal polycide layer, a second polysilicon layer, a refractory metal layer, and a thick aluminum alloy bonding pad.
|
申请公布号 |
US5661081(A) |
申请公布日期 |
1997.08.26 |
申请号 |
US19940316083 |
申请日期 |
1994.09.30 |
申请人 |
UNITED MICROELECTRONICS CORPORATION |
发明人 |
HSUE, CHEN-CHIU;CHIEN, SUN-CHIEH;CHEN, ANCHOR;HONG, GARY |
分类号 |
H01L21/603;H01L23/485;(IPC1-7):H01L21/283 |
主分类号 |
H01L21/603 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|