发明名称 |
Ultrasonic bonding process |
摘要 |
A method for bonding a metal wire (17) to a metal bond site (16) utilizes an ultrasonic power source (12) that is at approximately 162 KHz. A mash force is applied from a pressure source (13) during bonding. A metal exchange takes place between the metal wire (17) and the bond site (16) during the application of the ultrasonic power to produce a strong bond between the metal wire (17) and the bond site (16).
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申请公布号 |
US5660319(A) |
申请公布日期 |
1997.08.26 |
申请号 |
US19950373161 |
申请日期 |
1995.01.17 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
FALCONE, ROBERT J.;HOGAN, TIMOTHY J. |
分类号 |
B23K20/00;B23K20/10;H01L21/607;(IPC1-7):H01L21/607 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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