发明名称 THERMO-MODULE
摘要 PROBLEM TO BE SOLVED: To facilitate the attachments of small thermoelectric elements to a board, by using as the board disposed on one of the heat radiating and absorbing sides of a thermo-module a monoblock board covering the whole surface of the thermo-module, and by using as the board disposed on the other side a plurality of divided boards. SOLUTION: P-type and N-type thermoelectric elements 3 are arranged alternately at a fixed space on a divided board 1. For example, to every one divided board 1, the 18 pairs of thermoelectric elements 3, i.e., the 36 thermoelectric elements 3 are attached. In this case, since there are the 16 divided boards 1 in a thermo-module, the total number of the attached thermoelectric elements 3 is equal to 36×16=576. The faulty thermoelectric elements 3 are checked in the case of their attachments to each divided board 1. Aligning the 16 divided boards 1 having the arranged thermoelectric elements 3 thereon with another monoblock board 2 oppositely to each other, the divided boards 1 are soldered integrally with each other, attaching leading wires 4 to the elements 3. Since there are arranged many very small thermoelectric elements 3, the thermal efficiency of the thermo-module is improved, and since each thermoelectric element 3 may be attached satisfatorily to each divided board 1, its attachment can be facilitated.
申请公布号 JPH09223823(A) 申请公布日期 1997.08.26
申请号 JP19960029303 申请日期 1996.02.16
申请人 TEKUNISUKO:KK 发明人 KAWARADA ATSUSHI
分类号 H01L35/32;(IPC1-7):H01L35/32 主分类号 H01L35/32
代理机构 代理人
主权项
地址