| 摘要 |
PURPOSE:Not only to enable the correction of defects but also to eliminate steps easily by a method wherein a photosensitive insulating film is formed so as to level the steps, which is exposed to light and developed, the protruded insulating layer on a wiring layer is removed, and then an insulating layer is newly formed. CONSTITUTION:The whole face of a board is spin-coated with photopal, which is subjected to a heat treatment at a temperature of 85 deg.C for a half hour for the formation of a photosensitive insulating layer 6. In this process, the photosensitive insulating layer 6 has been formed in a recess 5 thicker than the other part. Then, the photosensitive layer 6 is exposed to light using a photomask and developed to remove the photosensitive insulating layer 6 on a wiring layer. Here, if a defect in evenness caused by the positional deviation of the mask is found, the photosensitive insulating layer can be selectively removed by ultrasonic cleaning. Next, the is thermally treated at a temperature of 200 deg.C for 30 minutes and 350 deg.C for 60 minutes in a nitrogen flow to enable the the photosensitive insulating layer 6 to become a flattened insulating layer 7. Then, an interlayer insulating layer 8 is newly formed. A process is reciprocated until a required number of layers are obtained for the formation of a multilayer wiring board. |
