| 摘要 |
<p>PURPOSE:To speed up a signal propagation speed without deteriorating mechanical strength and thermal conductivity characteristics by interposing an area having greater porosity between a conductive wiring and a conductive layer in insulation layers between respective conductive layers. CONSTITUTION:A sheet 10 is punched in the same pattern as a conductive wiring 6 formed on a green sheet 10 and sheets 10 of different thicknesses are pasted. Next, a hole 12 is opened on a given position of the sheet 10 and it is filled with paste, forming a viahole 5. A conductive wiring 6 is printed on the sheet 10 by copper sheet and a conductive layer 3 is printed on a reverse surface on which the wiring 6 is not printed. Next, a hole is opened on a given position of the sheet 10 and is filled with conductive paste 14 for viahole. The sheet into which hollow fine particles 13 are filled and the sheet 10 of only the viahole 5 are laminated. Then, a hole is opened in the sheet 10 corresponding to the obverse surface and the reverse surface. Conductor filling and obverse/ reverse surface pattern are printed and a laminate board is made, obtaining a ceramic multilayer circuit board.</p> |
