A bonding wedge (1) for an ultrasonic bonder, in particular an aluminium thick wire bonder, with a wire guide in the form of a through-passage (3) extending in the wire direction obliquely from above to the pressing face (2). A plastics sleeve (11) through which the bonding wire (4) is guided is introduced in the through-passage (3) to reduce significantly the frictional resistance of the bonding wire (4) in the region of the through-passage (3) and to reduce significantly the abrasion of aluminium.
申请公布号
DE3912580(C2)
申请公布日期
1997.08.21
申请号
DE19893912580
申请日期
1989.04.17
申请人
F & K DELVOTEC BONDTECHNIK GMBH, 82041 OBERHACHING, DE