发明名称 Beschichtung zur strukturierten Erzeugung von Leiterbahnen auf der Oberfläche von elektrisch isolierenden Substraten, Verfahren zum Herstellen der Beschichtung und von strukturierten Leiterbahnen
摘要 PCT No. PCT/EP96/04074 Sec. 371 Date Jul. 23, 1997 Sec. 102(e) Date Jul. 23, 1997 PCT Filed Sep. 18, 1996 PCT Pub. No. WO97/11589 PCT Pub. Date Mar. 27, 1997A coating for the structured production of conductors on the surface of electrically insulating substrates, in particular for producing sensor elements and printed circuit boards. The coating is formed from a doped tin oxide layer having the composition Sn1-(y+z)AyBzO2, in which A is Sb or F and B is In or Al. The relative proportions in the coating of the dopants antimony (or fluorine) and indium (or aluminum) are defined by the limits 0.02<y+z<0.11 and satisfy the condition 1.4<y/z<2.2. The coating can be structured by ablation using electromagnetic laser radiation in the wavelength range 157-1064 nm. The creates an economical means for high resolution and waste-free structuring of insulating channels in thin, electrically conductive layers having high chemical, mechanical and thermal resistance on glass or ceramic substrates.
申请公布号 DE19535068(C2) 申请公布日期 1997.08.21
申请号 DE1995135068 申请日期 1995.09.21
申请人 LPKF CAD/CAM SYSTEME GMBH, 30827 GARBSEN, DE 发明人 KICKELHAIN, JOERG, DIPL.-ING., 31535 NEUSTADT, DE;VITT, BRUNO, DR.RER.NAT., 52080 AACHEN, DE
分类号 B23K26/00;C03C17/25;C04B41/50;C04B41/87;H01L21/48;H01L23/498;H01S3/00;H05K1/03;H05K1/09;H05K3/00;H05K3/02;H05K3/08;(IPC1-7):H01L21/60;B60J1/20;C04B41/85;C03C17/23;H01L27/12 主分类号 B23K26/00
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