METHOD AND DEVICE FOR BONDING A WIRE CONDUCTOR

摘要

Process and device for the contacting of a wire conductor in the course of t he manufacture of a transponder unit arranged on a substrate and comprising a wire coil and a chip unit, wherein in a first phase the wire conductor is guided away via the terminal area, or a region accepting the terminal area and is fixed on the substrate relative to the terminal area or the region assigned to the terminal area, and in a second phase the connection of the wire conductor to the terminal area is effected by means of a connecting instrument.