| 摘要 |
A semiconductor device provided with a film having an opening and first and second surfaces; a semiconductor chip having first and second surfaces corresponding to the first and second surfaces of the film and positioned inside the opening along the film; a plurality of first leads fixed to the first surface of the film, a tip of each first lead being electrically connected to a first electrode provided on the first surface of the semiconductor chip; at least one second lead fixed to the first surface of the film; an electroconductive member in the form of, e.g., a film, fixed to the second surface of the film and electrically connected to a second electrode provided on the second surface of the semiconductor chip; and a connection member passing through the film and electrically connecting the second lead and the electroconductive member to each other. The second electrode on the second surface of the semiconductor chip is connected to the second lead on the first surface of the film via the electroconductive member and the connection member. There is also provided a method of manufacturing this type of semiconductor device. |
