发明名称 Monitoring hermetically sealed package containing food or fluid for pin holes
摘要 The monitoring method includes the placing of a hermetically sealed package (3), in which a conducting content (1), such as food, fluid or powder, is packed in an electrically insulating film (2). A side surface (31) of the hermetically sealed package is brought into contact with the top side of a carrier electrode (4) with a specified configuration such as an earthed electrode plate. A high DC voltage is applied across the carrier electrode and electrode (5) which is arranged in close contact with or adjoining an end part (3a) of the package. The contents (1) are charged if pin holes exist in the end part to be tested. The earthing at the electrodes in contact with the end part is removed. The detection of a discharge current from the end part of the package being monitored, allows pin holes in the hermetically sealed package to be detected.
申请公布号 DE19705528(A1) 申请公布日期 1997.08.21
申请号 DE19971005528 申请日期 1997.02.13
申请人 JOVEN DENKI K.K., TOYONAKA, OSAKA, JP 发明人 YASUMOTO, KENJI, TOYONAKA, OSAKA, JP
分类号 G01N27/92;B65B57/02;G01M3/40;G01N27/24;G01N27/61;(IPC1-7):G01M3/40;G01N27/20 主分类号 G01N27/92
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