发明名称 Semiconductor device having high integration
摘要 Semiconductor device comprises: (a) a semiconductor substrate (1) of a first conducting type with a doping layer (6,7,8) formed in the substrate; (b) a doping region (9) of second conducting type which penetrates a doping layer or one of the doping layers (6,7,8) and extends to a specified depth from the surface of the substrate; and (c) a contact conductor (4) formed on the substrate surface in contact with the doping region.
申请公布号 DE19651109(A1) 申请公布日期 1997.08.21
申请号 DE19961051109 申请日期 1996.12.09
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP 发明人 KOMORI, SHIGEKI, TOKIO/TOKYO, JP;YAMASHITA, TOMOHIKO, TOKIO/TOKYO, JP;INUISHI, MASAHIDE, TOKIO/TOKYO, JP
分类号 H01L21/768;H01L23/48;H01L29/78;(IPC1-7):H01L21/768;H01L21/28 主分类号 H01L21/768
代理机构 代理人
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