| 摘要 |
PURPOSE:To provide a highly heat-conductive epoxy film having a thickness of 100mum or below and excelling in heat, humidity and chemical resistances. CONSTITUTION:An electrically insulating, highly heat-conductive inorganic compound powder or fiber is added to a high-molecular weight epoxy polymer obtained by polymerizing a diepoxy resin and a diphenol by heating in the presence of a catalyst in an amide or ketone solvent having a boiling point of 130 deg.C or above under the conditions of a reaction solid concentration of 50wt.% or below, and the solvent is removed from the mixture. The weight- average molecular weight of the epoxy polymer is 70000 or above. |
