Clip head apparatus for retaining a semiconductor wafer on a pedestal

摘要

A clip assembly for retaining a semiconductor wafer on a pedestal during processing of the wafer, and releasing the wafer for removal from the pedestal after processing, includes a pair of tines each having a lower sloping surface for contacting an edge of an associated semiconductor wafer, and a ledge provided immediately above the lower sloping surface inward from a shared leading edge serves to catch debris or particulate material, preventing it from falling onto the surface of the semiconductor wafer. A metal spring, biasing the clip head into contact with the wafer, has an upper portion molded into the electrically non-conductive material of the clip head behind a front face thereof, whereby the spring and clip head form a monolithic assembly.