| 摘要 |
<p>PROBLEM TO BE SOLVED: To remove a thin semiconductor wafer of large diameter from a support body without breaking the wafer after etching. SOLUTION: Wafer stoppers 3 are formed at the tips of a support body 2 in order to prevent a semiconductor wafer 1, shown in a dotted line, from flipping out by centrifugal force when the support body 2 is turned. Projections 6 are formed on the support body 2 in order to prevent the semiconductor wafer 1 from being brought into tight contact with the support body 2. The tips of the projections 6 are triangular, and the vertices of the projections 6 are to be in contact with the semiconductor wafer 1 at linear contact areas 4. A rotational shaft 5 is joined to the center of the support body 2. The support body 2 is rotated at a specified number of revolutions, and etchant is sprayed on the semiconductor wafer 1 held on the supporting body 2. Films formed on the semiconductor wafer 1 is thereby selectively removed.</p> |
