| 摘要 |
PROBLEM TO BE SOLVED: To make water, which causes the generation of a crack, escape from communicating paths to make the water of vaporization in the peripheries of electronic elements, which are most easily exerted the effect of the water of vaporization, discharge by a method wherein the communication paths, which communicate with an island from at least the side surfaces or upper surface of a sealing resin, are provided. SOLUTION: A semiconductor chip 3 is bonded on a square-shaped island 1 via a paste-shaped bonding agent. With this, gold wires are respectively crosslinked between the chip 3 and lead terminals 4 and these electronic elements B are molded with a sealing resin C. Moreover, through holes 6 are respectively bored in the four corners of the square-shaped island 1, upper and lower through holes are bored also in the resin C in such a way as to communicate with these through holes 6 and at the upper and lower positions, where correspond to these through holes 6, on the surface and rear of the resin C, and these through holes are used as communicating paths 7. Accordingly, the holes 6 and the paths 7 are put in a state that they communicate with each other and moreover, the paths 7 communicate with the outside of the resin C molding the elements B. |
