发明名称 CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To lower the height from the main face of a circuit board to the projection, and reduce the cost of the projection and the mounting cost by providing a projection for wire wrapping on the extension of the main face of the circuit board, and also, making the projection in a body with the circuit board, at the periphery of the circuit board. SOLUTION: The board body 15 is equipped with a projection which projects from the periphery of the itself 15 onto the extension of the main face of itself, being made in a body with itself. Surface mount electric elements such as a variable resistor 3, a fixed resistor 4, etc., are mounted in the specified position of the main face where wiring 12 is made of the circuit board 11, and further the end of a lead wire 7 is wrapped around the projection 16. After wire wrapping around the projection 16, it is soldered using solder 8 so as to secure the electric continuity and fixing between the lead wire and the land 18. Hereby, the height from the main face of the circuit board to the projection can be lowered, and the member cost of the projection and the mounting cost can be reduced.
申请公布号 JPH09219571(A) 申请公布日期 1997.08.19
申请号 JP19960025543 申请日期 1996.02.13
申请人 MURATA MFG CO LTD 发明人 ONISHI KATSUHIRO;UEDA YUKINORI
分类号 H05K1/11;H05K1/18;H05K3/34 主分类号 H05K1/11
代理机构 代理人
主权项
地址
您可能感兴趣的专利