发明名称 MANUFACTURING METHOD OF SURFACE PROCESSED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To prevent generation of micro-crack by utilizing a wheel provided with an arc on the single or both shoulders of an outer periphery edge. SOLUTION: Single or both shoulders of the outer periphery of a wheel used in grinding are provided with R. Grinding is conducted so that a grinding direction may be reciprocative or a grinding trace may be fan-shaped, using the wheel. The preset in-feed depth of a grinding wheel is 0.05-20μm, and electrolytic in-process dressing is used. A grinding device whose loop rigidity is 150 N/μm or higher is used, and the material of a substrate is carbon. It is thus possible to increase the preset in-feed depth more than for a wheel without R for improved grinding efficiency.
申请公布号 JPH09216151(A) 申请公布日期 1997.08.19
申请号 JP19960050935 申请日期 1996.02.13
申请人 KAO CORP;NISSHIN KIKAI SEISAKUSHO:KK 发明人 YAMAMOTO YUZO;DAITO KIYOMASA
分类号 B24B7/22;B24B1/00;G11B5/84;(IPC1-7):B24B7/22 主分类号 B24B7/22
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