| 摘要 |
PROBLEM TO BE SOLVED: To minimize treatment steps in manufacturing a connector housing and an integrated circuit chip assembly. SOLUTION: First assembly 2 is electrically directly connected to a multi-wire bus, second assembly 6 is supported on the first assembly 2 so as to support an IC chip 14. The second assembly 6 comprises electric connection which connects an input/output device to the IC chip 14, and connects the multi-wire bus to the IC chip 14 so as to transfer signals between the multi-wire bus and the input/output device. The second assembly 6 comprises a single mold piece, and the mold piece comprises a mold socket 8 receiving the IC chip 14, a set of mold pins 16 which are conductions coated in order to electrically connect the input/output device and the IC chip 14, and mold positioning elements 18, 20 orienting the second assembly 6 to the first assembly 2. |
