| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin compsn. improved in flowability, resistance to soldering heat, thermal conductivity, and moisture resistance by compounding a specific epoxy resin, a phenol resin, a composite inorg. filler, and a cure accelerator. SOLUTION: This compsn. is prepd. by compounding an epoxy resin represented by formula I (wherein R<1> is t-butyl; R<2> is methyl; R<3> is Cl H2l+1 ; R<4> is Cm H2m+1 ; and (l) and (m) are each 0, 1, or higher), a phenol resin having backbone structures represented by formulas II and III (wherein (n) is 0, 1, or higher), 25-90wt.% composite inorg. filler comprising 20-80vol.% mixture of anα-alumina powder having an average particle size of 5-10μm and anα-alumina powder having an average particle size of 0.5-1μm and 80-20vol.% silica powder, and 0.01-5wt.% cure accelerator.
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