发明名称 Method of fabricating silicided LDD transistor
摘要 A gate-drain overlapped device, comprising: a first conductive type substrate; a gate insulating film formed on the substrate; a gate comprising a gate conductive line patterned on the gate insulating film, and a conductive layer coated on the gate conductive line and extending to a predetermined length on the gate insulating film; and a drain/source region comprising a second conductive type low density diffusion region in the substrate below the extending area of the conductive layer and a second conductive type high density diffusion region in contact with the low density diffusion region in the substrate, which is significantly improved in the resistance of a polysilicon gate conductive line and in uniform electrical properties.
申请公布号 US5658815(A) 申请公布日期 1997.08.19
申请号 US19960581787 申请日期 1996.01.02
申请人 LG SEMICON CO., LTD. 发明人 LEE, CHANG-JAE;KIM, TAE GAK
分类号 H01L21/28;H01L21/336;H01L29/49;H01L29/78;(IPC1-7):H01L21/265 主分类号 H01L21/28
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