MICROPACKAGE STRUCTURE

摘要

PROBLEM TO BE SOLVED: To mount a micromechanical device which requires a hollow part for sealing together with other semiconductor bare chips as a multi-chip module in the state of a bare chip. SOLUTION: A frame 14 which encloses a mechanical operational part and has a flat upper edge face is adhered and fixed on a substrate 11 of a micromechanical device with a terminal electrode 13 extracted from a mechanical operational part and a bump 15 is provided on the terminal electrode 13 extended to an outside of the frame 14. When an upper edge face of the frame 14 and a fixing substrate 17 are joined by a face-down method to the fixing substrate 17, a hollow part 19 is formed in a surface of a mechanical operational part.