| 摘要 |
PROBLEM TO BE SOLVED: To eliminate impedance mismatching in the connection part between first and second transmission lines and to obtain the good high-frequency transmission characteristics of a flip chip mounting structure by a method wherein gaps between a signal conductor conductor and grounding conductors in each of the regions, where oppose to each other, of the first and second transmission lines are respectively extended in a specified range and when conductive bumps are formed in a specified height, the gaps in he specified range are set in a prescribed height. SOLUTION: Gaps between a signal conductor conductor 11 and grounding conductors 12 in the region of a first transmission line 10 out of the regions, where oppose to each other, of the line 10 and a second transmission line 11 are extended to g3 and gaps between a signal conductor conductor 21 and grounding conductors 22 in the region of the line 11 out of the regions opposed to each other, of the lines 10 and 11 are extended to g4. When the height of conductive bumps 14 and 24 is assumed (h), the gaps g1 to g4 are set in g3-g1 g4-g2 2.5h. Thereby, impedance mismatching is not generated in the connection part between the lines 10 and 11 and good high-frequency transmission characteristics can be obtained. |
