| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the positional displacement of a semiconductor chip at the time of the assembly of a semiconductor device, and to reduce a fraction defective on assembly. SOLUTION: Electrodes on both surfaces of a semiconductor chip 3 are fixed onto the dowels 2a, 2b of first and second lead frames 1a, 1b through solder 4 respectively. The semiconductor chip 3 is positioned by locating pins 7 (shown in dotted lines) fitted to a carbon jig not shown. Slits 9 are formed so that the locating pins 7 can be inserted into holes for positioning formed to the carbon jig.</p> |
