发明名称 CERIUM OXIDE ABRASIVE, SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, PROCESS FOR THE PRODUCTION OF THEM, AND METHOD FOR THE POLISHING OF SUBSTRATES
摘要 <p>An abrasive comprising an aqueous slurry of the following cerium oxide particles: (1) cerium oxide particles prepared by adding hydrogen peroxide to an aqueous dispersion of cerium carbonate, (2) cerium oxide particles prepared by adding ammonium hydrogencarbonate to an aqueous solution of cerium nitrate to form a precipitate and oxidizing this precipitate with hydrogen peroxide, and/or (3) cerium oxide particles prepared by neutralizing or alkalinizing an aqueous solution of ammonium cerium nitrate.</p>
申请公布号 WO1997029510(P1) 申请公布日期 1997.08.14
申请号 JP1997000326 申请日期 1997.02.07
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