Vorrichtung zum Polieren von Fasen auf Halbleiterscheiben

摘要

A method and apparatus for polishing chamfers made along the periphery of a semiconductor wafer (W) designed such that when the wafer (W) is once picked up by a rotatory suction cup (25) of a transportation robot arm, the wafer is not released from the suction cup (25) until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups (25A to 25F) is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60 DEG to transfer the wafers (W).