Connecting semiconductor chip to lead-frame using LOC technology

摘要

The method involves arranging a number of semiconductor chips (12) with corresponding groups (22) of connecting fingers on the leadframes (24) on an assembly carrier (18), such that the top sides (16) of the chips on the carrier face upwards. Onto the top sides of the chips and/or the leadframe, an adhesive (36) is deposited, and the leadframe is set onto the assembly support so that the connecting fingers are located on the chip top sides. Then the adhesive between the frame and chips is hardened. The chips may be heated before being placed on the leadframe, by heating the assembly carrier.