| 摘要 |
<p>PURPOSE:To simplify the movement of wafers, by changing the direction of a wafer boat that is held with a holding mechanism in an upright attitude in parallel with the axis of a furnace core in correspondence with the opening part of a furnace body, receiving the boat with a holding mechanism provided on the side of the furnace body, and lifting and lowering the boat. CONSTITUTION:A process tube 4 is provided uprightly in a furnace body 2 of a heat treating apparatus that is provided in a longitudinal direction. A heater 6 is provided at the side part. A semiconductor 8 to be treated is held in a wafer boat 10. The wafer boat 10 is mounted on a lifting mechanism 12 which is lifted and lowered. The mechanism 12 is provided at the lower part of the tube 4. A mechanism 14 for holding the boat 10 is provided at the neighboring part of the mechanism 12. A direction changing mechanism 16 for changing the boat 10 in the vertical state and the horizontal state is provided at the neighboring part of the mechanism 12. When a wafer cassette 20 is sent on a working table 18 in this constitution, the wafer 8 is taken out with a transfer mechanism 22 and transferred into the boat 10 which is held with the holding mechanism 14. When the specified number of the wafers 8 are transferred, the boat 10 is changed into the vertical state with the mechanism 16. The boat is lowered and inputted into a heat insulating tube 23 for temporary storage.</p> |
