发明名称 |
Method and apparatus for mounting soldering balls onto electrodes of a substrate or a comparable electronic component |
摘要 |
A soldering ball mounting apparatus comprises a workpiece positioning mechanism "A" for positioning a workpiece 2 at a predetermined position. The workpiece 2 has an upper face formed with a plurality of electrodes 2a on which soldering balls 3 are mounted. A template 4, provided with a plurality of through holes 4a corresponding to the electrodes 2a in a one-to-one relationship, is supportable in such a manner that their through holes 4a are positioned just above the corresponding electrodes 2a of the workpiece 2. A soldering ball container 12 is provided on the template 4 for accommodating soldering balls 3 therein. The soldering ball container 12 has an open bottom allowing the soldering balls 3 to fall below the template 4 via the through holes 4a. A pair of X and Y motors shifts the soldering ball container 12 along the upper surface of the template 4 disposed in a horizontal direction.
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申请公布号 |
US5655704(A) |
申请公布日期 |
1997.08.12 |
申请号 |
US19950520284 |
申请日期 |
1995.08.28 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SAKEMI, SHOJI;NISHINAKA, TERUAKI |
分类号 |
B23K3/06;H05K3/34;(IPC1-7):B23K1/20 |
主分类号 |
B23K3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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