发明名称 |
Method to install an electronic component and its electrical connections on a support, and product obtained thereby |
摘要 |
Disclosed is a method for installing an electronic component and its electrical connections on a support provided with a cavity to house said component. A metallic layer is cut out into zones on which there is deposited a layer of polyimide which mechanically holds the said zones during the operations for the electrical connection of the electronic component and for encapsulation and installation on the support. This method avoids the use of a supporting film and of a bonder to fix the metallic joints to the film, namely elements that do not withstand high temperatures during encapsulation.
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申请公布号 |
USRE35578(E) |
申请公布日期 |
1997.08.12 |
申请号 |
US19940198208 |
申请日期 |
1994.02.28 |
申请人 |
SGS-THOMSON MICROELECTRONICS, INC. |
发明人 |
GLOTON, JEAN-PIERRE;COITON, GERARD |
分类号 |
G06K19/077;H01L23/498;(IPC1-7):H05K3/34 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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