发明名称 |
Method for forming a monolithic electronic module by dicing wafer stacks |
摘要 |
A fabrication method and resultant monolithic electronic module comprising a plurality of stacked planar extending arrays of integrated circuit chips. The fabrication method includes dicing a wafer of integrated circuit chips into a plurality of arrays of integrated circuit chips. The arrays of integrated circuit chips are then stacked to form an electronic module. A metallization pattern may be deposited on a substantially planar surface of the electronic module, and used to interconnect the various arrays of integrated circuit chips contained therein. Specific details of the fabrication method and resultant multi-chip package are set forth. |
申请公布号 |
US5656553(A) |
申请公布日期 |
1997.08.12 |
申请号 |
US19960655529 |
申请日期 |
1996.05.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LEAS, JAMES MARC;VOLDMAN, STEVEN HOWARD |
分类号 |
H01L25/00;H01L21/66;H01L21/98;H01L25/065;(IPC1-7):H01L21/302 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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