| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin compsn. for semiconductor sealing which contains a filler excellent in miscibility and dispersibility in a resin and excellent in water-adsorbing properties and water retention in the resin by selecting a specific amorphous silica having a fixed particle shape as the filler. SOLUTION: This compsn. contains an epoxy resin, a hardner, and an inorg. filler in an amt. of 65-90wt.% of the compsn. At least 5wt.% of the filler is fixed-shape amorphous silica particles, pref. substantially spherical particles, having an average particle size of 0.5-30μm, a specific surface area of 5-60m<2> /g, an equilibrium moisture adsorption (at 50%RH) of 5-15%, and a bulk density of 0.40-1.4g/ml. Further pref. the particles contain U and Th each in a concn. of 1ppb or lower and have such adsorption characteristics that the amt. of water adsorbed reaches the equilibrium within 50hr at 50%RH.
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