| 发明名称 |
High thermal resistance backfill material for hybrid UFPA's |
| 摘要 |
A porous film 64 is used to thermally insulate sensing integrated circuitry 44 from pixels 34 of an uncooled IR detector hybrid system 30. The porous film 64 is preferably a silicon-dioxide xerogel. A protective film 65 may be deposited on the porous film 64.
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| 申请公布号 |
US5656848(A) |
申请公布日期 |
1997.08.12 |
| 申请号 |
US19950477004 |
申请日期 |
1995.06.07 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
BERATAN, HOWARD R.;CHO, CHIH-CHEN |
| 分类号 |
G01J5/20;G01J5/34;H01L23/532;H01L27/146;(IPC1-7):H01L31/058;H01L31/101;H01L31/09 |
主分类号 |
G01J5/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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