首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SOLDER MATERIAL
摘要
申请公布号
JPH09206981(A)
申请公布日期
1997.08.12
申请号
JP19960014151
申请日期
1996.01.30
申请人
TAIHO KOGYO CO LTD;TOYOTA MOTOR CORP;SORUDAA KOOTO KK
发明人
TANAKA YASUHISA;ISHIDA HIDEKI;NARITA KATSUHIKO;HARA SHIRO
分类号
B23K35/26;C22C11/10;C22C13/00;(IPC1-7):B23K35/26
主分类号
B23K35/26
代理机构
代理人
主权项
地址
您可能感兴趣的专利
MEMORY CARD
FREMGANGSMAATE TIL FREMSTILLING AV ULTRA-HOEYMOLEKYLAERE ALKENPOLYMERER.
PROCESS AND DEVICE FOR BONING ANIMAL HEADS.
SHAKE FLASK HAVING AERATION ENHANCING MEANS.
CORIOLIS MASS FLOWMETERS.
IMPROVED REGISTRATION METHOD IN PHOTOLITHOGRAPHY AND EQUIPMENT FOR CARRYING OUT THIS METHOD.
PLATE HEAT EXCHANGER.
PROGRAMMABLE TESTER WITH BUBBLE MEMORY.
MINIATURIZED SENSOR FOR PHYSIOLOGICAL PRESSURE MEASUREMENTS.
Semiconductor element and its manufacturing method.
COURSE GUIDE DISPLAY SYSTEM FOR NAVIGATION DEVICE
Interior equipment of a vehicle.
VIPPEMEKANISME, FORTRINNSVIS FOR STOLSETE ELLER LIGNENDE.
DATA TRANSMISSION METHOD FOR A DIGITAL SWITCHING SYSTEM
Device for the controlled conveyance of a web to a printing machine.
Conveying method for plates.
Process of improving of reutilized sizing agents.
Method to polish semiconductor wafer without streaks.
Pneumatic walking beam conveyor for transferring and loading.
Coupling device for broadband signals.
