| 摘要 |
PROBLEM TO BE SOLVED: To provide a high thermal conductivity composite material having high thermal conductivity, reduced in specific gravity, and excellent in heat resistance and its production. SOLUTION: A powder mixture, having a composition consisting of, by weight, 20-70% copper and the balance silicon carbide powder of >=1.0wt.% oxygen content, is compacted and then sintered at 1080-1200 deg.C in a nonoxidizing atmosphere of 1×10<-5> to 1×10<-3> partial pressure of oxygen. By this method, the high thermal conductivity composite material, consisting of 20-70wt.% copper and the balance silicon carbide and having <=10ppm/ deg.C thermal expansion coefficient in the temp. region between room temp. and 800 deg.C and >=80W/m.K thermal conductivity, can be obtained. |
