CURABLE EPOXY RESIN COMPOSITION AND ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition excellent in shelf stability before curing, having good initial adhesiveness and durability of adhesion, and suitable as a protective agent for electronic parts, and provide electronic parts coated with a cured material of this composition and excellent in reliability. SOLUTION: This composition consists of 100 pts.wt. curable epoxy resin and 0.1-500 pts.wt. organopolysiloxane represented by the average unit formula (R<1> SiO3/2 )a (R<2> 2SiO2/2 )b (R<2> 3 SiO1/2 )c (R<3> O1/2 )d (wherein R<1> is an epoxy-containing movalent organic group; each R<2> may be the same as or different from any other R<2> and is a monovalent hydrocarbon group; R<3> is H or a 4C or lower alkyl; (a), (b) and (d) are each a positive number; and (c) is 0 or a positive number) and obtained by equilibrium polymerization. The electronic parts are coated with a cured material of this composition.