Semiconductor wafer having slices and limited scribe areas for implementing die

摘要

A semiconductor wafer in an intermediate stage of fabrication having an array of slices. All but one of the slices may have integrated circuit components interconnected by metallization layers to form a die having an operable circuit, with the remaining slice functioning as a scribe area or line. Two embodiments of slices are disclosed in which one slice is a rectangle of a minimum width to function as a scribe area, and the other slice is composed of a sliver and a rectangle with the latter also having a minimum width to function as a scribe area. Each embodiment of a slice can be extended lengthwise with an extension box that also can function to contain operative components or function as a scribe area.