发明名称 |
Forming rigid circuit board |
摘要 |
A method and apparatus for forming a rigid circuit board uses a circuit board with a reduced thickness in a bend region. The bend region may have several layers of laminate and conductive material. The circuit board is heated to the glass transition temperature which allows the circuit board to become flexible. The apparatus has two rollers used to form the bend region to a predetermined shape. When the circuit is cooled, the circuit board again becomes rigid in its predetermined shape.
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申请公布号 |
US5655291(A) |
申请公布日期 |
1997.08.12 |
申请号 |
US19950494747 |
申请日期 |
1995.06.26 |
申请人 |
FORD MOTOR COMPANY |
发明人 |
TODD, MICHAEL GEORGE;BELKE, JR., ROBERT EDWARD;GORDON, ROBERT JOSEPH |
分类号 |
H05K3/00;(IPC1-7):H05K3/36 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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