| 摘要 |
A method for testing an integrated circuit die having interconnect pads in a package having leads in a configuration compatible with test, burn-in and handling equipment. The method includes the steps of placing the interconnect pads in direct contact with the leads of the package without forming a permanent connection to the interconnect pads, conducting burn-in tests on the die, electrically testing the integrated circuit of the die and disconnecting the interconnect pads from the leads of the package. In a preferred approach, the die is placed in the package and a nonpermanent pressure contact is made with each of the interconnect pads. In another aspect of the invention, a fixture is provided for making temporary electrical connections with an integrated circuit die having interconnect pads arranged in a predetermined pattern. The fixture includes contact elements carried by a substantially rigid support member in a pattern corresponding to the predetermined pattern of interconnect pads and adapted to engage a single die. An engagement assembly is provided for bringing the interconnect pads and the contact elements together to make nonpermanent temporary simultaneous electrical connections therebetween. The engagement assembly includes a package having leads in a configuration compatible with test, burn-in and handling equipment for conventional integrated circuit packages.
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