| 摘要 |
A thermal micro flow sensor including a heating wire, said heating wire being made of a material having a resistivity in the range from 3.1x10-7 OMEGA m to 2x10-2 OMEGA m like polysilicon so that said heating wire has a resistance about 1 k OMEGA , said heating wire being formed on a semiconductor material so that said heating wire has a thermal isolation structure for isolating said heating wire from said semiconductor substrate.
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