Verfahren zur Herstellung eines mit einer dünnen Kupferfolie kaschierten Substrats für Leiterplatten,申请号DE19926020588-传众专利搜索

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发明名称	Verfahren zur Herstellung eines mit einer dünnen Kupferfolie kaschierten Substrats für Leiterplatten
摘要
申请公布号	DE69220588(D1)	申请公布日期	1997.08.07
申请号	DE19926020588	申请日期	1992.02.12
申请人	MITSUBISHI GAS CHEMICAL CO., INC., TOKIO/TOKYO, JP	发明人	ISHII KENJI, C/O MITSUBISHI GAS CHEMICAL, KATSUSHI;NAKAI, TAKAMASA;MATUSMOTO, HIROYUKI;MORIYAMA, KENICHI, C/O MITSUBISHI GAS CHEMICA, ASH
分类号	B32B15/08;C23F1/18;H05K3/00;H05K3/02;H05K3/06;H05K3/26;(IPC1-7):H05K3/02	主分类号	B32B15/08
代理机构		代理人
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地址

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