| 摘要 |
A moulding powder which is curable with the application of heat and pressure, comprising a mechanical mixture consisting of: a) a powdered epoxy compound containing on average more than one epoxy group in the molecule and having a softening point of above 60 DEG C, b) a powdered aliphatic or N-heterocyclic amine or a powdered amino group-containing adduct based on an aliphatic, cycloaliphatic, araliphatic or N-heterocyclic amine containing on average more than one amino group in the molecule and having a melting point or softening point of above 60 DEG C and, optionally, c) customary additives for moulding powders, the particles of a) and b) being smaller than 200 mu m, is excellently suited for the preparation of coatings on heat-sensitive substrates and is used in particular in powder coating.
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