| 摘要 |
<p>An apparatus for inspecting leads of an IC package (2) by forming images of illuminated leads. Lighting devices (3 and 4) disposed at the center of the bottom surface of the IC package to illuminate the leads have a width corresponding to a center area of the bottom surface of the IC package, where the lead terminals (1) of the IC package (2) do not exist, a length greater than stand-off of the lead terminals (1) of the IC package (2) and a height such that light can be radiated to only the lead terminals closer to the center portion of the IC package from the distal end portions of the leads. Cameras (7 and 8) for imaging the leads (1) are disposed to measure highly precisely the flatness of the lead terminals.</p> |
