摘要 |
Ceramic multilayer substrates as circuit supports for complex electronic circuits wth integrated capacitors are manufactured by printing capacitor structures, using the screen printing process, directly onto a first green ceramic film. The first green ceramic film with the printed structures is arranged in a stack with further green ceramic films, laminated, and fired. During lamination of the ceramic films, the printed structures are pressed into the ceramic films so that after firing, a multilayer substrate with integrated capacitors results. |
申请人 |
ROBERT BOSCH GMBH, 70469 STUTTGART, DE |
发明人 |
STEINLE, KLAUS, 71065 SINDELFINGEN, DE;DE LA PRIETA, CLAUDIO, 70569 STUTTGART, DE;MOSER, MANFRED, DIPL.-ING., 72768 REUTLINGEN, DE;SEIBOLD, ANNETTE, DIPL.-PHYS. |