Surface complemental heat dissipation device

摘要

A natural convection heat dissipation device for a microprocessor is disclosed. The microprocessor 12 is conventionally mounted to a printed circuit board 20. The printed circuit board 20 contains a recess 22 that is cut-out directly below the microprocessor 12. Heat sink material 24 is attached to the microprocessor 12 through the recess 22. The heat sink material 24 attached to the bottom of the microprocessor 12 with adhesive may be used alone or in conjunction with an attached metal tray 32 or case under the printed circuit board 20. The heat sink acts as a complement to a main heat sink 14 which may be held by clips attached to the pcb 20.