| 发明名称 |
Semiconductor device encapsulated in resin |
| 摘要 |
The insulating characteristics of the package are improved by introducing cuts (10,12), grooves (14) and positioning holes (18) in the metal plate (9) and shaping in appropriate form the retractable positioning pins of the metal plate (9) in the moulding die. <IMAGE> |
| 申请公布号 |
EP0545487(B1) |
申请公布日期 |
1997.08.06 |
| 申请号 |
EP19920203676 |
申请日期 |
1992.11.27 |
| 申请人 |
CONSORZIO PER LA RICERCA SULLA MICROELETTRONICA NEL MEZZOGIORNO |
发明人 |
MANGIAGLI, MARCANTONIO;POGLIESE, ROSARIO |
| 分类号 |
B29C45/14;B29L31/34;G11C11/34;H01L21/56;H01L23/28;H01L23/495;H01L23/50 |
主分类号 |
B29C45/14 |
| 代理机构 |
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